Alloying Tin with Bismuth is a popular option and alternative to solder, as this eliminates the risk of poisoning that is posed by Lead. Silver is another alternative to Lead, but also a more expensive solution.

Tin/Bismuth alloys produce usable solders. Bismuth helps to increase the melting point of tin, and allows for enhancement of the strength of connectors.

Typically, a solder connection for bonding faying surfaces is formed of Tin-Bismuth, and comprises a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy.

Tin/Bismuth is recommended for its:

  • Corrosion Resistance
  • Higher melting point
  • Solderability
  • Non-Toxic/Non-Carcinogenic Properties